电路板公司

制造能力manufacture capability

技术项目technology project 制造能力manufacture capability

产品类型product type 铝基板aluminium base board

表面处理surface treatment 喷锡HAL/化锡immersion tin /沉锡immersion sliver/化金gold plating/osp

层数layers 1-4层1-4layer

尺寸maximium dimension 1100mm*480mm

小尺寸minimium dimension 5*5mm

板翘曲度warp&twist 小于0.5mm(厚度1。6MM300*300)<0.5mm(thickness :1.6mm dimension 300*300)

成品厚度finish product thickness 0.2-4.5mm

铜箔厚度copperfoil thickness 18um -140um

孔内铜厚hole inner copper thickness 18-40um

孔位偏差hole position tolerance #NAME?

小冲孔直径minimum punching hole diameter板厚1。0MM以下1。0MMboard thickness<0.1MM

小冲方曹规格the minimum punching square slot specifkation板厚1.0mm以下0.8*0.8mm board thickness<1.0 0.8*0.8mm

丝印线路偏差silk prints circuit tolerance cnc锣板：+_0.1mm模冲：+_0.75mm cnc:+_0.1mm mould :+_0.75mm

小孔径mininal aperture 0.8mm孔径不限no limitation in maximum hole dimension for borad over 0.8

v-cut角度偏差v-cut angle deviation #NAME?

v-cut切割v-cut board thickness range 0.6-3.2mm

小元件字符minimum open window for PADS0.01MM

阻焊类型solder mask types 绿green 白white 蓝blue 亚光黑blue mattblack灰色grey